0.4mm pitch
BGA pads
QFP IC and
Components
Traceability QR code
Cross-sectioned
via hole
High density of SMD pads
UL marking
Blind &Buried Vias
Cu Filling
On Blind Vias
Fine Pitch
Width/Space
30um/30um
V-CUT
Cross-sectioned
via hole
Brown-oxidation
Acute Registration
of LPISM ±40um
| 雙面軟板 Double sided flex |
汽車中控系統(tǒng) Automotive infotainment system |
| QFN & BGA IC加底部填充膠 IC with underfilled glues |
| 空板+打件+功能測試一站式服務(wù) FPCA+FCT one stop solution |
UL 796F & UL94VTM-0 |
制程能力 Manufacturing Capabilities | 標(biāo)準(zhǔn) Standard | 先進(jìn) Advanced | |
層數(shù) | Layer Count (circuit layers) | 1 to 8 layers | ＞8 layers |
初始銅厚 | Base Copper Thickness | 1/4oz - 2oz | 2um - 7oz |
最小線寬線距和公差 | Min.trace/space (Cu:6~9um） | 35±10um | 25±5um |
Min.trace/space (Cu:12um) | 35±10um | 28±5um | |
Min.trace/space (Cu:18um) | 45±15um | 30±6um | |
Min.trace/space (Cu:35um) | 100±20um | 70±15um | |
蝕刻因子： 2*銅厚/(底寬-頂寬) | Etching Factor： 2H/（Wb-Wt） | ＞3 *限制條件 Subject to conditions | ＞5 *限制條件 Subject to conditions |
最小通孔孔徑/焊盤 | Min.Via/PAD | 0.05/0.15mm | 0.03/0.10mm |
線路與鉆孔對(duì)位精度 | Image and hole registration | ±0.075mm | ±0.030mm |
阻焊油墨精度 | Solder Mask Registration | ±0.06mm | ±0.04mm |
最小阻焊油墨橋 | Min. Solder Mask Bridge | 0.08mm | 0.07mm |
最小阻焊油墨開口 | Min.Solder Mask Opening | 0.32mm × 0.32mm | 0.25mm × 0.25mm |
字符印刷精度 | Legend Pringting Registration | ±0.30mm | ±0.10mm |
補(bǔ)強(qiáng)/雙面膠貼合公差 | Stiffener/PSA Reg.Tolerance | ±0.25mm | ±0.15mm |
金手指到外形邊 距離公差 | Golden Finger to edge tolerance | ±0.07mm | ±0.05mm |
阻抗控制 | Impedance Control | +/-10% | +/-7.5% |
化學(xué)鎳金 | ENIG | 鎳Ni:40u＂-360u＂ 金Au:1u＂-4u＂ | 鎳Ni:40u＂-80u＂ 金Au:2u＂-4u＂ |
電鍍鎳金 （硬金和軟金） | Electrolytic Nickel & Gold (Soft Gold & Hard Gold) | 鎳Ni:40u＂-500u＂ 金Au:1u＂-12u＂ | 鎳Ni:80u＂-200u＂ 金Au:≤60u＂ |
電鍍直金（軟金） | Direct Gold Plating (Soft) | 12u" - 28 u＂ | ≤60u＂ |
化學(xué)沉錫 | Immersion Tin（Sn） | 10u＂-40u＂ | NA |
化學(xué)沉銀 | Immersion Silver（Ag） | 3u＂- 15u＂ | 5u＂-12u＂ |
有機(jī)助焊保護(hù)劑 （抗氧化） | OSP(Anti-Oxidation) | 4u＂- 26u＂ | 8u＂-16u＂ |
UL 796F（全UL認(rèn)證） | UL 796F（Full UL） | 單面板/雙面板/多層板/軟硬結(jié)合板 Single sided/Double sided/ Muti-layered/Rigid-flex | |
UL 94V-0(阻燃) UL 94VTM-0(阻燃) | UL 94V-0(Flame Retardant) UL 94VTM-0(Flame Retardant) | 單面板/雙面板/多層板/鏤空板/ 軟硬結(jié)合板/雙面硬板 Single sided/Double sided/Muti-layered/Bare-back flex/Rigid-flex/ Double sided Rigid | |
| 8層軟硬結(jié)合板 8-layered rigid-flex |
工控 Industrial |
高玻璃轉(zhuǎn)化溫度材料 High Tg material |
棕化處理 Brown-oxidation |
微割處理 V-CUT |
6層軟板 6-layered flex |
| 人工智能 Artificial Intelligence |
尺寸Size： 800mm*20mm |
黑色阻焊油墨 Black LPISM |
阻抗控制 Impedance control:100±10Ω |
我們的參考標(biāo)準(zhǔn) Our Workmanship Reference | |
IPC-JPCA-6202 單雙面撓性印刷板的性能手冊 Single and Double sided flexible printed board performance manual | IPC-6011 印制板通用性能規(guī)范 Generic Performance Specification forPrinted Boards |
IPC-6012D 剛性印制板鑒定及性能規(guī)范 Qualification and Performance Specification for Rigid Printed Boards | IPC-6013D 撓性印制板鑒定及性能規(guī)范 Qualification and Performance Specification for Flexible Printed Boards |
JIS C5016-1994 柔性印制電路板的實(shí)驗(yàn)方法 Test Method For Flexible Print Circuit Board | IPC-TM-650 實(shí)驗(yàn)方法手冊 Manual Of Experimental Methods |
IPC-A-600J 印制電路板的允收標(biāo)準(zhǔn) Acceptability of Printed Boards | IPC-A-610F 電子組件的可接受性要求 Acceptability Requirements For Electronic Components |
IPC-4552 用于印制板的非電鍍鎳/浸金(ENIG)鍍規(guī)范 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards | IPC-4553 用于印制板的浸銀鍍規(guī)范 Specification for Immersion Silver Plating for Printed Circuit Boards |
IPC-4554 用于印制板的浸錫鍍規(guī)范 Specification for Tin Plating for Printed Circuit Boards | J-STD-003 印制板的可焊性測試 Solderability Tests for Printed Boards |
IPC-9252 未組裝印制板電氣測試要求 Requirements for Electrical Testing of Unpopulated Printed Boards | |
| 4層HDI軟板 4-layered HDI flex |
醫(yī)療 Medical |
線寬/間距 Width/Space: 0.03/0.03mm |
盲孔與埋孔 Blind & Buried Microvias |
銅厚及公差 Copper thickness and tolerance：6±2um |
UL 796F & UL94V-0 |
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